Leti-CEA


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17 Avenue des Martyrs, 38054 Grenoble

Category: Microtechnics

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International Research Team Achieves First-Reported, Complete Vascularization of Organoids on Microfluidic Chip

Chemistry - Health

In Vitro System Bypasses -Complex Technical Setups- of Alternative Approaches And Supports Production Scaling e Interdisciplinary Research Institute of Grenoble (IRIG) , CEA-Leti and fellow European and Canadian institutes and researchers have demonstrated the complete vascularization of organoids on a microfluidic chip at speeds and flow rates similar to blood's, improving functional maturation and enabling their long-term survival.

EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals

CEA-Leti, Fraunhofer, imec and VTT Anchoring Multi-Hub Platform to Realize Designs By EU Companies, Researchers and Chip Developers A new European Union consortium created to accelerate the development of next-generation, ed

Architecture - Feb 21

Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems

CEA-Leti Develops Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems -ISSCC 2024 Presentation Reports Accurate Speech Recognitio a t Power Consumption Below One Microwatt GRENOBLE, Fra

CEA-Leti Papers at Photonics West Report Progress Towards MicroLED Bandwidth and Efficiency Improvement

CEA-Leti will present two papers on its microLED technology advances at Photonics West 2024 about making matrices of LEDs with increased data-rate density, and strategies to reduce their efficiency loss at small sizes.

CMOS-Compatible 200mm Process Technology Close to State-of-the-Art GaN/SiC Performance at Lower Cost

CEA-Leti Develops CMOS-Compatible 200mm Process Technology Close to State-of-the-Art GaN/SiC Performance at Lower Cost -Technology for 5G & 6G infrastructure, satcom, radar for UAV detection and other applications uses existi

Innovation - Dec 5, 2023

Applied Materials and CEA-Leti Unveil Joint Lab For Rapidly Growing Specialty Chip Markets

Innovation

Based at CEA-Leti, Collaboration Focuses on Materials Engineering Solutions. To Accelerate Semiconductor Device Development for Applied's ICAPS Customers.

CEA-Leti Reports Breakthrough 3D Sequential Integration (3DSI) Of CMOS Over CMOS with Advanced Metal Lines

CEA-Leti, Fraunhofer, imec and VTT Anchoring Multi-Hub Platform to Realize Designs By EU Companies, Researchers and Chip Developers.

UC San Diego and CEA-Leti Report First IC for Piezoelectric Resonator DC-DC Conversion Achieving a 310% Loss Reduction

ISSCC 2024 Paper Says 'Ground-Breaking' DC-DC Converter Unifies Power Switches on a Single Chip-. S AN DIEGO and GRENOBLE, France - Feb.

Economics - Dec 15, 2023

CEA-Leti Reports Breakthrough 3D Sequential Integration (3DSI) Of CMOS Over CMOS with Advanced Metal Lines

Achievement establishes the feasibility of manufacturing high-performance silicon CMOS devices above an industrial platform, including state-of-the-art BEOL, without compromising the performance of the bottom layer CEA-Leti

Mathematics - Physics - Dec 7, 2023

CEA-Leti Paper in Nature Communications Reports First Complete Memristor-Based Bayesian Neural Network Implementation For Real-World Task

Breakthrough Classifies Types of Arrhythmia Recordings With Precise Aleatoric and Epistemic Uncertainty - A team comprising CEA-Leti, CEA-List and two CNRS laboratories has published a new paper in Nature Communications pr