Master’s Thesis

Master’s Thesis

Design of a Single-Ended Simultaneous Bidirectional (SDB) Link for 64 Gb/s Chip-to-Chip Communication

Ref. 2026_006

Modern high-speed chip-to-chip communication links using full duplex operation enable simultaneous transmission and reception over the same channel. This requires a combined TX/RX structure, known as a hybrid, at both ends of the link. The hybrid serves as a signal separation element whose primary role is to suppress the transmitter’s own signal so the receiver can detect only the incoming data from the remote end. Full duplex communication offers the advantage of effectively doubling the data throughput per line while also reducing latency, since data flows bidirectionally at the same time.

The goal of this project is to design a single ended simultaneous bidirectional (SDB) link that meets these full duplex requirements for next generation chip to chip communication. The target data rate is 64 Gb/s, and the implementation will be carried out in a state of the art CMOS technology within an industrial research environment.

Students interested in this project should have completed coursework in digital IC design and/or analog integrated circuits. The work is best suited for a Master’s thesis, although in exceptional cases a Bachelor’s thesis may also be considered. Please note that paid internships are not available for this project.





Diversity & Work Environment

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How to Apply

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