Kandou Bus has raised 56 million dollars. It will allow the spin-off to market a new component needed for the recently approved USB4 specification.© 2019 matejmo
In its latest funding round, Kandou Bus has raised 56 million dollars - mainly from Swiss investors. The proceeds will allow the specialist in high-speed, low-power connectivity to market a new component needed for the development of USB-C plugs that are compatible with the recently approved USB4 specification. Kandou Bus, an EPFL spin-off based at the School's Innovation Park, has raised 56 million dollars. This third funding round brings its tally of outside investments to nearly 100 million dollars. While US investors dominated the first two rounds of funding, three Swiss groups joined this third round: Swisscom Ventures, Forestay Capital and Fayerweather Capital Partners. The startup focuses on one of the major challenges faced by the electronics industry: high-speed, low-power connectivity inside and between devices. Its advances have already led to the revision of several industry standards.
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