Min-Feng Yu, a professor of mechanical science and engineering, and his graduate student have developed a novel approach for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics.
CHAMPAIGN, Ill. University of Illinois engineers have developed a novel direct-writing method for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics. Integrated chips are made by wiring multiple transistors and electronic components together to perform complex functions. The connections between chips and circuit boards traditionally are made from pre-fabricated metal wires that connect to a designated bonding pad on a chip. 'Integrated functions require many wire connections. It's tedious and time-consuming to make and increases cost,? said Min-Feng Yu, a professor of mechanical science and engineering at Illinois. In addition, the bonding pad for traditional wire bonds takes up a substantial area of space.
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