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CEA-LETI


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Innovation - Economics - 27.02.2024
EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals

Innovation - Economics - 27.02.2024
CEA-Leti Reports Breakthrough 3D Sequential Integration (3DSI) Of CMOS Over CMOS with Advanced Metal Lines

Architecture - 21.02.2024
Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems
CEA-Leti Develops Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems -ISSCC 2024 Presentation Reports Accurate Speech Recognitio a t Power Consumption Below On

Materials Science - 20.02.2024
UC San Diego and CEA-Leti Report First IC for Piezoelectric Resonator DC-DC Conversion Achieving a 310% Loss Reduction
ISSCC 2024 Paper Says 'Ground-Breaking' DC-DC Converter Unifies Power Switches on a Single Chip S AN DIEGO and GRENOBLE, France - Feb.

Physics - Event - 26.01.2024
CEA-Leti Papers at Photonics West Report Progress Towards MicroLED Bandwidth and Efficiency Improvement
CEA-Leti will present two papers on its microLED technology advances at Photonics West 2024 about making matrices of LEDs with increased data-rate density, and strategies to reduce their efficiency loss at small sizes. Described in the paper, - Parallel Communication with InGaN/GaN Micro-LEDs Using a CMOS Compatible Approach - making LEDs directly on a 200 mm silicon substrate opens the way to producing a matrix of LEDs of a few microns that are individually controlled by dedicated CMOS circuits.

Economics - 15.12.2023
CEA-Leti Reports Breakthrough 3D Sequential Integration (3DSI) Of CMOS Over CMOS with Advanced Metal Lines
Achievement establishes the feasibility of manufacturing high-performance silicon CMOS devices above an industrial platform, including state-of-the-art BEOL, without compromising the performance of t

Innovation - Computer Science - 15.12.2023
CMOS-Compatible 200mm Process Technology Close to State-of-the-Art GaN/SiC Performance at Lower Cost
CEA-Leti Develops CMOS-Compatible 200mm Process Technology Close to State-of-the-Art GaN/SiC Performance at Lower Cost -Technology for 5G & 6G infrastructure, satcom, radar for UAV detection and other

Innovation - 05.12.2023
Applied Materials and CEA-Leti Unveil Joint Lab For Rapidly Growing Specialty Chip Markets
Applied Materials and CEA-Leti Unveil Joint Lab For Rapidly Growing Specialty Chip Markets

Microtechnics - Innovation - 17.10.2023
PRESSE - CEA-Leti Launches R&D Program to Improve 'Cooperation' Between Autonomous Vehicles
PRESSE - CEA-Leti Launches R&D Program to Improve ’Cooperation’ Between Autonomous Vehicles
R&D Vision Includes Adapting Wireless Technology for Drones and Robots in Factories - CEA-Leti today announced a new R&D initiative to contribute to a higher level of vehicle automation and

Innovation - Transport - 20.06.2023
Concentrated competence in battery management: Vitesco Technologies France cooperates with CEA
First results were presented at the EVS36 symposium from June 11, to June 14, in the United States.

Life Sciences - Health - 24.05.2023
Brain Computer Interface (BCI) enables thought-controlled walking after spinal cord injury
Brain Computer Interface (BCI) enables thought-controlled walking after spinal cord injury
Neuroscientists and neurosurgeons from EPFL/CHUV/UNIL and CEA/CHUGA/UGA report in the journal Nature that they have re-established the communication between the brain and spinal cord with a wireless digital bridge, allowing a paralyzed person to walk again naturally.

Innovation - Economics - 20.04.2023
Leti Innovation Days Will Explore Microelectronics’ Role In Enabling Transformational Technologies

Innovation - 20.04.2023
Leti Innovation Days Will Explore Microelectronics’ Role In Enabling Transformational Technologies on June 27-29

Event - 13.04.2023
CEA-Leti to Report Progress on 3D Interconnects for Wafer-Level Platforms

Innovation - 13.02.2023
Skiing more efficiently thanks to a French Alps-based collaborative innovation
Skiing more efficiently thanks to a French Alps-based collaborative innovation
Established by a consortium of stakeholders from the Auvergne-Rhône-Alpes region, the Smart Ski Experience project explores a new connected ski technology that will offer snow sports enthusiasts an unprecedented ski experience.

Physics - Event - 25.01.2023
CEA-Leti’s recent advances on key AR building blocks, e.g. retinal projection and holography
GRENOBLE, FRANCE - Jan.

Innovation - Electroengineering - 07.07.2022
A Close Look at Major Microelectronics Challenges
Why does the microelectronics industry occupy such a crucial place? How has the industry become central to the digital transformation of our society? Today, electronic components can be found in everyday life, from energy production to agriculture, health, and safety.

Innovation - Economics - 08.04.2022
Roadmap FD-SOI by CEA, STM, Soitec and GlobalFunderies
Roadmap FD-SOI by CEA, STM, Soitec and GlobalFunderies
CEA, Soitec, GlobalFoundries and STMicroelectronics have announced a new collaboration in which they intend to jointly define the industry's next generation roadmap for FD-SOI (fully depleted silicon-on-insulator) technology.

Innovation - Computer Science - 24.03.2022
CEA-Leti and Startup C12 Join Forces to Develop Next-Generation Quantum Computers
CEA-Leti and Startup C12 Join Forces to Develop Next-Generation Quantum Computers
With Multi-Qubit Chips at Wafer Scale Building on the breakthrough of manufacturing quantum chips on 200mm silicon wafers using CMOS processes, C12 is pursuing the next materials leap in quantum compu

Life Sciences - Physics - 22.03.2022
Scientist, Elisa Vianello, Receives ¤3 Million ERC Grant To Develop Nanoscale Memories Inspired by Insect Nervous Systems
CEA-Leti Scientist, Elisa Vianello, Receives €3 Million ERC Grant To Develop Nanoscale Memories Inspired by Insect Nervous Systems The artificial intelligence (AI) community recently has proposed po

Innovation - Computer Science - 01.03.2022
CEA and Spectronite Develop Software Radio For Spectrally Efficient Backhaul Solutions
CEA and Spectronite Develop Software Radio For Spectrally Efficient Backhaul Solutions
GRENOBLE and SOPHIA-ANTIPOLIS, France - CEA, a French key player in research, development and innovation, and Spectronite , a leading innovator in wireless backhaul technology, today announced they

Health - Innovation - 16.12.2021
CES 2022: CEA-Leti to Unveil World’s-First Multi-Sensor System For Knee-Implants That Improves Surgery Accuracy, Detects Infection Early and Enhances Rehabilitation
GRENOBLE, France - Dec. CEA-Leti, a CEA microelectronics research institute, will introduce a smart, integrated multi-sensor system for knee implants at CES 2022 that can help surgeons more accurately position the implant, dramatically reduce risk of follow-up surgery, and enhance rehabilitation.

Pharmacology - Innovation - 18.11.2021
GTP Nano leverages CEA's NanO'up R&D facility to produce its first batches of drugs for precision therapies
GTP Nano leverages CEA’s NanO’up R&D facility to produce its first batches of drugs for precision therapies

Computer Science - Environment - 13.09.2021
CEA-Leti Proposes Nine Research Tracks to Guide ICT Industry’s Quest to Reduce its Carbon Footprint
Pa per to Be Presented at IEEE ESSCIRC/ESSDERC Conference in September Warns of Unsustainable Increase in Power Use, Notes Potential Advantages for European Industry In Collaborative Response.

Research Management - Life Sciences - 12.08.2021
Europe invests against the loss of smell: CEA participates in the research project

Innovation - Economics - 01.07.2021
Sebastien Dauvé Named CEA-Leti CEO

Innovation - Economics - 01.07.2021
Sébastian Dauvé named CEA-Leti CEO

Innovation - 17.06.2021
CEA-Leti reports record performance of nMOS devices fabricated with a maximum temperature of 500°C
CEA-Leti reports record performance of nMOS devices fabricated with a maximum temperature of 500°C

Innovation - 15.06.2021
CEA-Leti collaborates with siemens to launch process design kit that supports multiple technologies, simplifies creation of optical circuits
CEA-Leti collaborates with siemens to launch process design kit that supports multiple technologies, simplifies creation of optical circuits

Economics - Innovation - 31.05.2021
CEA-Leti Launches Direct Analysis to Bring Speed And Efficiency to Food-Safety Testing

Computer Science - Physics - 28.05.2021
CEA-Leti Introduces Plastic mmWave System for Applications Requiring Ultra-Low Latency and Ultra-High-Speed Connectivity
MmWave systems operate in frequency ranges from 30 to 300 GHz. CEA-Leti's previous work in mmWave communications includes design and use of 5G networks on the MINATEC campus in Grenoble.

Computer Science - Event - 27.05.2021
Hardware to Highlight Leti Innovation Days, June 22-23
Hardware to Highlight Leti Innovation Days, June 22-23

Life Sciences - Computer Science - 20.04.2021
CEA-Leti Announces EU Project to Mimic Multi-Timescale Processing of Biological Neural Systems
Targeted Applications Include High-Dimensional Distributed Environmental Monitoring, Implantable Medical-Diagnostic Microchips, Wearable Electronics & Human/Computer Interfaces - GRENOBLE, Franc

Health - Life Sciences - 10.04.2021
Slowing the progression of Parkinson's disease through neuroillumination: first clinical trial
Slowing the progression of Parkinson's disease through neuroillumination: first clinical trial
Slowing the progression of Parkinson's disease through neuroillumination: first patient implant in first clinical trial -The CEA, Grenoble Alpes University Hospital, Grenoble Alpes University and

Transport - 18.03.2021
World's First Autonomous Imager For Smartphones, Smart-Home Appliances and Automobiles
World’s First Autonomous Imager For Smartphones, Smart-Home Appliances and Automobiles
It is the first smart image sensor jointly featuring auto-exposure for all lighting conditions and 88dB dynamic range, as well as motion detection and feature extraction for event-based functioning, and AI-based object recognition that triggers highly reliable identification.

Innovation - Research Management - 12.03.2021
Ascent+ European Nanoelectronics Acess
Ascent+ European Nanoelectronics Acess
The ASCENT+ access programme launches a new phase to become the powerhouse of researchers and innovators in nanoelectronics in Europe ASCENT+ mobilises an unprecedented network of knowledge and inves

Mechanical Engineering - Life Sciences - 08.03.2021
CEA-Leti Envisions Widespread Use of LiDAR Systems Based on Integrated Optical Phased Arrays (OPAs)
OPAs with Solid-State Beam Steering Can Reduce the Cost and Size of LiDAR Systems & Improve Performance; Results Reported at Photonics West 2021 -GRENOBLE, France - March 8, 2021 - Taking a criti

Physics - Health - 02.03.2021
CEA-Leti Announces 16 Papers to Be Presented At Photonics West 2021 and a Virtual Workshop on March 25

Physics - Health - 02.03.2021
CEA-Leti Announces 17 Papers to Be Presented At Photonics West 2021 and a Virtual Workshop on March 25

Innovation - 12.02.2021
Legrand and CEA combine their expertise to develop a new generation wireless and batteryless switch
Legrand and CEA combine their expertise to develop a new generation wireless and batteryless switch
I ntegrating perfectly with Legrand's "with Netatmo" connected offerings, thi s innovation makes the connected home more sustainable by reducing environmental impact and maintenance operations due to battery use.

Physics - Electroengineering - 04.02.2021
French Team on Route Towards an Interposer Prototype for Quantum And Control Chips Integration at Very Low Temperature
French Team on Route Towards an Interposer Prototype for Quantum And Control Chips Integration at Very Low Temperature
Platform Optimizes Control and Readout of Qubits by Placing Control Electronics Near Quantum Chips Without Wire Bonding GRENOBLE, France - Feb.

Physics - Computer Science - 03.02.2021
New EU Quantum Flagship consortium launches a project on silicon spin qubits as a platform for large-scale quantum computing
New EU Quantum Flagship consortium launches a project on silicon spin qubits as a platform for large-scale quantum computing
The QLSI project brings together 19 top European groups to focus on developing highly scalable quantum processors in silicon, and marks a recent addition to the EU's Quantum Flagship a 10-year, ¤1 Billion R&D initiative launched in 2018 GRENOBLE, France - Feb.

Innovation - 05.01.2021
Three CEA startups challenge tomorrow's societal transitions
Three CEA startups challenge tomorrow's societal transitions
From January 11 to 14, 2021, the CEA will participate in the Consumer Electronic Show (CES) for the 7th consecutive year.

Physics - Materials Science - 15.12.2020
Aledia Announces it Has Produced its First Nanowire Chips on 300mm Silicon Wafers Using CEA-Leti Pilot Lines
Aledia, French Developer of Next-Generation MicroLED Displays For High-Volume Consumer Markets, Announces it Has Produced its First Nanowire Chips on 300mm Silicon Wafers Using CEA-Leti Pilot Lines Echirolles, France, Dec.

Economics - 17.11.2020
CEA-Leti and Davey Bickford Enaex Extend R&D Collaboration To Bring More Digital Solutions to Mining and Blasting Industries That Improve Safety for Workers and Increase Productivity
CEA-Leti and Davey Bickford Enaex Extend R&D Collaboration To Bring More Digital Solutions to Mining and Blasting Industries That Improve Safety for Workers and Increase Productivity

Event - 17.11.2020
CEA-leti to present latest results & insights on 3d Technologies, Power Electronics & Quantum Computing at IEDM 2020
CEA-leti to present latest results & insights on 3d Technologies, Power Electronics & Quantum Computing at IEDM 2020

Physics - Computer Science - 29.10.2020
CEA-Leti to Build Quantum-Photonics Platform to Ensure Ultra-Secure Data for Finance, Energy, Defense and Other Industries
Pr oj ect Wil l Build Demo nstrators for Transmitting and Receiving Qubits and Focus on Integrating the Technology in a Unique Platform to Address Quantum Computing Applications.

Physics - 27.10.2020
CEA-Leti Announces Collaboration with Intel to Advance Chip Design Through Cutting-Edge 3D Packaging Technologies
CEA-Leti Announces Collaboration with Intel to Advance Chip Design Through Cutting-Edge 3D Packaging Technologies
What's new: CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design.

Innovation - Materials Science - 03.10.2020
CEA Will Demonstrate Five Innovations for the E-mobility, Green Energy, Connected Health, Digital Camera and Agri-food Markets at CES 2019
CEA Will Demonstrate Five Innovations for the E-mobility, Green Energy, Connected Health, Digital Camera and Agri-food Markets at CES 2019

Physics - Materials Science - 03.10.2020
Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology For Highly Reliable Security and ID Applications
Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology For Highly Reliable Security and ID Applications
L eti today announced that the European R&D project known as PiezoMAT has developed a pressure-based fingerprint sensor that enables resolution more than twice as high as currently required by the U.S. Federal Bureau of Investigation (FBI).