science wire

This work demonstrates Feasibility of Combining Hybrid Bonding and High-Density Through-Silicon Vias DENVER - May 31, 2024 - CEA-Leti scientists reported a series of successes in three related project

Three-Layer Test Vehicle Is a Key Milestone Because It Demonstrates.

The European InSecTT project focuses on the security of embedded AI. As a partner in this three-year project, CEA-Leti developed innovative solutions to authenticate intelligent systems and protect them from various cyberattacks. These advances coincide with the promulgation of the European AI Act. The EU InSecTT project wrapped up in the Fall of 2023, only a few months before the promulgation of the European AI Act.

CEA-Leti Develops Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems -ISSCC 2024 Presentation Reports Accurate Speech Recognitio a t Power Consumption Below On

ISSCC 2024 Paper Says 'Ground-Breaking' DC-DC Converter Unifies Power Switches on a Single Chip S AN DIEGO and GRENOBLE, France - Feb.

CEA-Leti will present two papers on its microLED technology advances at Photonics West 2024 about making matrices of LEDs with increased data-rate density, and strategies to reduce their efficiency loss at small sizes. Described in the paper, - Parallel Communication with InGaN/GaN Micro-LEDs Using a CMOS Compatible Approach - making LEDs directly on a 200 mm silicon substrate opens the way to producing a matrix of LEDs of a few microns that are individually controlled by dedicated CMOS circuits.

Achievement establishes the feasibility of manufacturing high-performance silicon CMOS devices above an industrial platform, including state-of-the-art BEOL, without compromising the performance of t

CEA-Leti Develops CMOS-Compatible 200mm Process Technology Close to State-of-the-Art GaN/SiC Performance at Lower Cost -Technology for 5G & 6G infrastructure, satcom, radar for UAV detection and other

R&D Vision Includes Adapting Wireless Technology for Drones and Robots in Factories - CEA-Leti today announced a new R&D initiative to contribute to a higher level of vehicle automation and

First results were presented at the EVS36 symposium from June 11, to June 14, in the United States.

Neuroscientists and neurosurgeons from EPFL/CHUV/UNIL and CEA/CHUGA/UGA report in the journal Nature that they have re-established the communication between the brain and spinal cord with a wireless digital bridge, allowing a paralyzed person to walk again naturally.

Established by a consortium of stakeholders from the Auvergne-Rhône-Alpes region, the Smart Ski Experience project explores a new connected ski technology that will offer snow sports enthusiasts an unprecedented ski experience.

GRENOBLE, FRANCE - Jan.

Why does the microelectronics industry occupy such a crucial place? How has the industry become central to the digital transformation of our society? Today, electronic components can be found in everyday life, from energy production to agriculture, health, and safety.

CEA, Soitec, GlobalFoundries and STMicroelectronics have announced a new collaboration in which they intend to jointly define the industry's next generation roadmap for FD-SOI (fully depleted silicon-on-insulator) technology.

With Multi-Qubit Chips at Wafer Scale Building on the breakthrough of manufacturing quantum chips on 200mm silicon wafers using CMOS processes, C12 is pursuing the next materials leap in quantum compu

CEA-Leti Scientist, Elisa Vianello, Receives €3 Million ERC Grant To Develop Nanoscale Memories Inspired by Insect Nervous Systems The artificial intelligence (AI) community recently has proposed po

GRENOBLE and SOPHIA-ANTIPOLIS, France - CEA, a French key player in research, development and innovation, and Spectronite , a leading innovator in wireless backhaul technology, today announced they

GRENOBLE, France - Dec. CEA-Leti, a CEA microelectronics research institute, will introduce a smart, integrated multi-sensor system for knee implants at CES 2022 that can help surgeons more accurately position the implant, dramatically reduce risk of follow-up surgery, and enhance rehabilitation.

Pa per to Be Presented at IEEE ESSCIRC/ESSDERC Conference in September Warns of Unsustainable Increase in Power Use, Notes Potential Advantages for European Industry In Collaborative Response.

MmWave systems operate in frequency ranges from 30 to 300 GHz. CEA-Leti's previous work in mmWave communications includes design and use of 5G networks on the MINATEC campus in Grenoble.

Targeted Applications Include High-Dimensional Distributed Environmental Monitoring, Implantable Medical-Diagnostic Microchips, Wearable Electronics & Human/Computer Interfaces - GRENOBLE, Franc

Slowing the progression of Parkinson's disease through neuroillumination: first patient implant in first clinical trial -The CEA, Grenoble Alpes University Hospital, Grenoble Alpes University and

It is the first smart image sensor jointly featuring auto-exposure for all lighting conditions and 88dB dynamic range, as well as motion detection and feature extraction for event-based functioning, and AI-based object recognition that triggers highly reliable identification.

The ASCENT+ access programme launches a new phase to become the powerhouse of researchers and innovators in nanoelectronics in Europe ASCENT+ mobilises an unprecedented network of knowledge and inves

OPAs with Solid-State Beam Steering Can Reduce the Cost and Size of LiDAR Systems & Improve Performance; Results Reported at Photonics West 2021 -GRENOBLE, France - March 8, 2021 - Taking a criti

I ntegrating perfectly with Legrand's "with Netatmo" connected offerings, thi s innovation makes the connected home more sustainable by reducing environmental impact and maintenance operations due to battery use.

Platform Optimizes Control and Readout of Qubits by Placing Control Electronics Near Quantum Chips Without Wire Bonding GRENOBLE, France - Feb.

The QLSI project brings together 19 top European groups to focus on developing highly scalable quantum processors in silicon, and marks a recent addition to the EU's Quantum Flagship a 10-year, €1 Billion R&D initiative launched in 2018 GRENOBLE, France - Feb.

From January 11 to 14, 2021, the CEA will participate in the Consumer Electronic Show (CES) for the 7th consecutive year.

Aledia, French Developer of Next-Generation MicroLED Displays For High-Volume Consumer Markets, Announces it Has Produced its First Nanowire Chips on 300mm Silicon Wafers Using CEA-Leti Pilot Lines Echirolles, France, Dec.