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CEA-LETI


Results 21 - 36 of 36.


Physics - 17.12.2020
CEA-Leti Papers at IEDM 2020 Highlight Progress in Overcoming Challenges
Gallium Nitride Seen as Highly Efficient Replacement for Silicon in Wide Range of Consumer and Industrial Uses GRENOBLE , France - Dec. Two complementary research papers from CEA-Leti confirmed that the institute's approach to gallium-nitride (GaN) technologies is on track overcome challenges in the architecture and performance of advanced GaN devices embedding a MOS gate, and targeting the fast-growing global market for power-conversion systems.

Computer Science - 16.12.2020
CEA Institutes Combine 3D Integration Technologies & Many-Core Architectures to Enable High-Performance Processors That Will Power Exascale Computing
CEA Institutes Combine 3D Integration Technologies & Many-Core Architectures to Enable High-Performance Processors That Will Power Exascale Computing
Invited paper at IEDM 2020 shows benefit of CEA-List's architectures in co-optimizing CEA-Leti's 3D toolbox to enable higher bandwidth & heterogeneity for high-performance processors. CEA Institutes Combine 3D Integration Technologies & Many-Core Architectures to Enable High-Performance Processors That Will Power Exascale Computing S AN FRANCISCO - Dec.

Physics - 13.10.2020
CEA Achieves Mass-Spectrometry Breakthrough that Paves the Way to Detecting Viruses
CEA Achieves Mass-Spectrometry Breakthrough that Paves the Way to Detecting Viruses
With Ultimate Goal of Improving Virus Knowledge, Team Now Will Use its Optomechanical System to Design a Prototype for Airborne Virus Analysis GRENOBLE, France - Oct. Targeting analysis of biological particles with large aspect ratios, such as viruses or fibrils, CEA scientists have demonstrated a breakthrough in single-particle mass spectrometry (MS) that could fast track the detection of viral particles in hospitals, offices, airplanes and other public places.

Physics - 22.06.2020
CMOS Device Fabrication at 500°C, Paving the Way to High-Performance 3D Monolithic CMOS Integration
CMOS Device Fabrication at 500°C, Paving the Way to High-Performance 3D Monolithic CMOS Integration
VLSI 2020 Paper Details First Proof of Integration of FDSOI CMOS Devices Processed at 500°C, for Further 3D Monolithic Integration GRENOBLE, France - June 22, 2020 - In an FDSOI CMOS processing breakthrough, CEA-Leti scientists have pushed fabrication thermal-process boundaries down to 500°C for CMOS integration, while showing strong performance gains especially in P-type metal-oxide-semiconductor (PMOS) logic devices.

Physics - 16.06.2020
CEA-Leti Demonstrates Breakthrough Architecture for HPC Devices Using Gate-All-Around Nanosheet Fabrication Process
Virtual Presentation During VLSI 2020 Details Transistors' Performance And Power-Use Advantages Versus FinFET Devices -GRENOBLE, France - June 15, 2020 - CEA-Leti has demonstrated fabrication of a new gate-all-around (GAA) nanosheet device as an alternative to FinFET technology targeting high-performance (HPC) applications such as smartphones, laptops, and mobile systems with data collection and processing involving low-power and high-speed operation.

Electroengineering - 11.06.2020
Researchers Break Throughput Record for LiFi Communications Using Single GaN Blue Micro-Light-Emitting Diode
Researchers Break Throughput Record for LiFi Communications Using Single GaN Blue Micro-Light-Emitting Diode
Data-Transmission Rate of 7. Gbps Positions LiFi as Possible Replacement for WiFi with Further R&D and Industrial Standardization to Ensure Interoperability of Systems capability of 5G. GRENOBLE, France - June 11, 2020 CEA-Leti today announced its researchers have broken the throughput world record of 5.

Physics - Electroengineering - 18.02.2020
CEA-Leti and CEA-IRIG Demonstrate Quantum Integrated Circuit Combining Quantum Dot with Digital-Analog Circuits on CMOS Chip
CEA-Leti and CEA-IRIG Demonstrate Quantum Integrated Circuit Combining Quantum Dot with Digital-Analog Circuits on CMOS Chip
Presentation at ISSCC 2020 Shows Role FD-SOI Can Play in Embedding Qubit Arrays with Classic Electronics to Build Large-Scale Quantum Silicon Processors SAN FRANCISCO - Feb. Leti, an institute of CEA, and CEA-IRIG, a fundamental research institute, have created the world's first quantum integrated circuit that demonstrates the possibility of integrating conventional electronic devices and elements with quantum dots on a CMOS chip.

Physics - 11.12.2019
CEA-Leti and partners demonstrate potentially scalable readout system for large arrays of quantum dots
'Results Hold promise for Fast, Accurate Single-Shot Readout 'Of Foundry-Compatible Si MOS Spin Qubits' 'SAN FRANCISCO ' Dec. 11, 2019 ' Leti, a technology research institute of CEA Tech, and its research partners have demonstrated a potentially scalable readout technique that could be fast enough for high-fidelity measurements in large arrays of quantum dots.

Physics - Music - 06.09.2019
The Force of Sound: CEA-Leti Manipulates Cells & Bacteria Samples Using Non-contact Evanescent Acoustic Tweezers
The Force of Sound: CEA-Leti Manipulates Cells & Bacteria Samples Using Non-contact Evanescent Acoustic Tweezers
Evanescent Acoustic Beam Moves Suspended Particles at Lower Cost & Energy Consumption Than Existing Propagative Surface Acoustic Wave (SAW) Systems. CEA-Leti has developed a new acousto-microfluidic technology for manipulating microand nanoscale samples using evanescent sound waves. Described in a paper published in the September issue of Nature (Comm.

Life Sciences - Innovation - 18.07.2019
Weebit Nano and CEA-Leti to demonstrate brain-inspired neuromorphic demo
The demo enables massively parallel, low-power and low-latency computation abd will be demonstrated at Flash Memory Summit 2019, August 6-8. Weebit Nano (ASX: WBT), the Israel-based semiconductor company seeking to develop and commercialize the next generation of memory technology, and CEA-Leti, a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry, will demonstrate a new neuromorphic demo able to perform precise object recognition tasks in an energy-efficient manner at Flash Memory Summit 2019.

Innovation - Physics - 03.06.2019
CEA-Leti and Silvaco Team Up!
Project Combines CEA-Leti's Semiconductor Development Expertise and Silvaco's SPICE Simulation and Variability Analysis Technologies LAS VEGAS - June 3, 2019 - Leti, a research institute of CEA-Tech, and Silvaco Inc., a leading global provider of software, IP and services for designing chips and electronic systems for semiconductor companies, today announced, during the 56 th Design Automation Conference (DAC) in Las Vegas, a project to estimate and model the yield of ultra-low-voltage (ULV), ultra-low-leakage (ULL) static random access memory (SRAM) used in computing applications.

Physics - 19.03.2019
Next-Generation, Low-Cost Photo-Acoustic Sensors For Gas Detection And Analysis
Next-Generation, Low-Cost Photo-Acoustic Sensors For Gas Detection And Analysis
REDFINCH Team Achieves These Capabilities in Mid-infrared Region, Where Many Important Chemical and Biological Species Have Strong Absorption Fingerprints GRENOBLE, France - March 19, 2019 - Leti, a research institute of CEA Tech, today announced prototype development of highly miniaturized, portable optical sensors for chemical detection of gas.

Pharmacology - Innovation - 27.02.2019
CEA-Leti Breakthrough Opens Path To New Vaccine for HIV using Lipid-Nanoparticle-Delivery Technology
CEA-Leti Breakthrough Opens Path To New Vaccine for HIV using Lipid-Nanoparticle-Delivery Technology
Lipidots Platform Strengthens Immune Response to Protein That Is Key to HIV Vaccine; Results Presented in Nature Publishing Group's npj Vaccines GRENOBLE, France - Feb. Leti, a research institute of CEA Tech, in collaboration with CEA's Fundamental Research Division , has developed a new vaccine approach for HIV based on engineered lipid nanoparticles that deliver p24 - a viral protein that is key to an HIV vaccine- and optimize the CpG adjuvant's effect.

Computer Science - 20.02.2019
CEA-Leti and Stanford Target Edge-Ai Apps with Breakthrough NVM Memory Cell
Paper at ISSCC 2019 Presents Proof-of-Concept Multi-Bit Chip that Overcomes NVM's Read/Write, Latency and Integration Challenges SAN FRANCISCO - Feb. Researchers at CEA-Leti and Stanford University have developed the world's first circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM.

Innovation - Physics - 06.02.2019
CEA-Leti combines integrated optics and holography in novel lens-free, augmented reality technology
Leti, an institute of CEA-Tech, has developed a novel retinal-projection concept for augmented reality (AR) uses based on a combination of integrated optics and holography. The lens-free optical system uses disruptive technologies to overcome the limitations of existing AR glasses, such as limited field-of-view and bulky optical systems.

Physics - 05.02.2019
CEA-Leti builds prototype of next-generation mid-infrared optical sensors for portable devices
SAN FRANCISCO - Feb. CEA-Leti today announced it has prototyped a next-generation optical chemical sensor using mid-infrared silicon photonics that can be integrated in smartphones and other portable devices. Coin-size, On-chip Sensors that Combine High Performance and Low Power Consumption Presented in Paper at SPIE Photonics West 2019.