With Multi-Qubit Chips at Wafer Scale Building on the breakthrough of manufacturing quantum chips on 200mm silicon wafers using CMOS processes, C12 is pursuing the next materials leap in quantum computing: using carbon nanotubes to build quantum bits, or qubits, the fundamental building blocks of quantum computers.

GRENOBLE and SOPHIA-ANTIPOLIS, France - CEA, a French key player in research, development and innovation, and Spectronite , a leading innovator in wireless backhaul technology, today announced they have adapted and optimized CEA-Leti's spectrally efficient waveform with enhanced spectral efficiency for Spectronite's X-Series modem for 5G systems.

GRENOBLE, France - Dec. CEA-Leti, a CEA microelectronics research institute, will introduce a smart, integrated multi-sensor system for knee implants at CES 2022 that can help surgeons more accurately position the implant, dramatically reduce risk of follow-up surgery, and enhance rehabilitation.

In-memory energy is a supplemental feature to in-memory computing, which is a key focus in CEA-Leti's roadmap. It can reduce energy use dramatically because RRAM-based batteries are highly scalable and dynamically allocable, and they can be placed next to memory blocks, which are near the processor.

CEA-Leti Scientist, Elisa Vianello, Receives €3 Million ERC Grant To Develop Nanoscale Memories Inspired by Insect Nervous Systems The artificial intelligence (AI) community recently has proposed powerful algorithms that will enable machines to learn from experience and interact autonomously with the environment.

SAN FRANCISCO - Dec. CEA, in collaboration with CNRS Néel, a leading team in SI-based quantum c'omputing, presented two papers on that topic at IEDM 2021, including an invited paper that identifies the material and integration challenges facing large-scale Si quantum computing.

SAN FRANCISCO 2021 - CEA-Leti has reported the world's-first demonstration of 16-kbit ferroelectric random-access memory (FeRAM) arrays at the 130nm node that advances this energy-saving technology closer to commercialization.